Everwide JD541-2 One Component Epoxy Adhesive
JD541-2 is one component epoxy adhesive for electronic devices bonding. This product is designed for curing at temperature from 120°C to 180°C. This resin exhibits good adhesion strength, high Tg, greasy resistance, chemical and solvent resistance. This resin is able to be fast cure at high temperature and suitable for different kinds materials bonding. The durability of this product is very high levels and this resin can pass many environmental test experiments. This product is well suited for electronic devices bonding.
- This product is solvent-free and non-volatile system.
- The hardening surface will not exhibit a surface oiliness.
- This resin exhibits high viscosity and excellent thixotropy. This product can be also controlled flow and have sag resistance.
- This product offers excellent chemical resistance and solvent resistance.
- Cured resin is highly vibrate-resist at ordinary temperature.
- This product complies to the 2011/65/EU RoHS regulations.
