Everwide JD100-5 Epoxy for Underfill

Name: Everwide JD100-5 Epoxy for Underfill
Brand: Everwide

Color: Black

Viscosity

Hardness

Packaging

Product Type

Application

JD100-5 is one component epoxy adhesive for the application of rework and electronic devices. Cured product is easy to operate and suited for various applications of electronic components, such as casting and sealing. This resin can be fast cured at high temperature, is able to reduce the working time and increase the efficiency at the same time. This product develops tough, strong, structural bonds which provide excellent shear, peel and impact strength. The durability of this resin is very high levels and this resin can pass many environmental test experiments. This product is well suited for flip-chip underfill packaging process, and it can quickly fill the gap between the wafer complete package.

This product is solvent-free, non-volatile, system and has no volative materials and will not release any toxic volatilizations.

The hardening surface will not exhibit a surface oiliness and poor gloss.

This product has low shrinkage.

The reactivity of this product is good at the temperature higher than 150°C.

Cured product is effective against moisture and water.

This product complies to the 2011/65/EU RoHS regulations.

This product complies to chlorine < 900ppm, bromine < 900ppm, chlorine + bromine < 1500ppm.

Glass Transition Temp.,(TMA), °C	124
CTE*² (<Tg), μm/m/°C	32
CTE*² (>Tg), μm/m/°C	110
Durometer Hardness, Shore D	90
Flexural Modulus, GPa	8
Specific Gravity	1.6
Water Absorption Ratio (25°C/24hr), %	0.1
Water Absorption Ratio (80°C/24hr), %	0.6
Water Absorption Ratio (97°C/1.5hr), %	0.2
Degradation Temp., (TGA 10°C/min), °C	335
Weight Loss Ratio@100°C, %	0
Weight Loss Ratio@150°C, %	0
Weight Loss Ratio@200°C, %	0
Weight Loss Ratio@250°C, %	0.26
Weight Loss Ratio@300°C, %	2.46
Weight Loss Ratio@350°C, %	6.38
Volume Resistivity, ohm-cm	4.5*10¹⁵
Surface Resistivity, ohm	4.5*10¹⁴
Dielectric Constant 1KHz	3.2

*¹ Specimen Cure Condition：150°C / 30min

*² CTE: Coefficient of Thermal Expansion

This resin should be kept without any possibility of moisture and heat exposure. It should be storage at -40°C ~ -5°C before opening the containers. Shelf life of this product is eight months.

Before using, it should place this product at 14~34°C for 2 to 3 hours. After using, replace this product at -40°C ~ -5°C immediately. The viscosity and properties will be changed when replace this product at room temperature for long time

Appearance	Liquid
Color	Black
Viscosity 25°C, S14 3rpm, cps	90,000-200,000
Thixotropic Index	>4
Specific Gravity	1.57
Filler Content, %	55
Particle Size, um	2-10

Pot Life 25°C, days	3-5
Through Cure Time 150°C, min	30

Everwide JD100-5 Epoxy for Underfill

Features

Uncured Properties

Curing Properties

Cured Properties

Storage and Shelf Life

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