Everwide JC750 One Component Epoxy Adhesive

Name: Everwide JC750 One Component Epoxy Adhesive
Brand: Everwide

Color: Black

Viscosity

Hardness

Packaging

Product Type

Application

JC750 is a one component epoxy adhesive for electronic devices bonding. This product exhibits good adhesion strength, high hardness, greasy resistance, chemical and solvent resistance. This resin can be fast cure at low temperature and is suited for different kinds materials bonding. The durability of this product is very high levels and this resin can pass many environmental test experiments. This product is well suited for heat sensitive components bonding, Memory cards and C-MOS assembling.

This product is solvent-free and non-volatile system.

The hardening surface will not exhibit a surface oiliness and poor gloss.

This resin offers excellent retention of electrical insulation properties under high humidity conditions.

This product offers excellent chemical resistance and solvent resistance.

This resin is highly vibrate-resist at ordinary temperature.

This product complies to the 2011/65/EU RoHS regulations.

This product complies to chlorine < 900ppm, bromine < 900ppm, chlorine + bromine < 1500ppm.

Glass Transition Temp.,(MDSC), °C	30
CTE*² (0-25°C), μm/m/ °C	47
CTE*² (75-100°C), μm/m/ °C	225
Specific Heat 0°C, J/g°C	5.23
Specific Heat 25°C, J/g°C	5.45
Specific Heat 50°C, J/g°C	5.77
Specific Heat 75°C, J/g°C	5.96
Specific Heat 100°C, J/g°C	6.10
Durometer Hardness, Shore D	77
Specific Gravity	1.69
Water Absorption Ratio (25°C /24hr), %	0.43
Water Absorption Ratio (80°C /24hr), %	1.96
Water Absorption Ratio (97°C /1.5hr), %	1.17
Shear Strength*³ Al vs. PC, kgf/cm²	33
Shear Strength*⁴ Al vs. PC, kgf/cm²	20
Shear Strength*⁵ Al vs. PC, kgf/cm²	62
Shear Strength*⁶ Al vs. PC, kgf/cm²	55
Shear Strength*⁷ Al vs. PC, kgf/cm²	87
Elongation, %	7.2
Degradation Temp. (TGA 10°C /min), °C	326
Weight Loss Ratio@100°C, %	0.42
Weight Loss Ratio@150°C, %	0.73
Weight Loss Ratio@200°C, %	1.03
Weight Loss Ratio@250°C, %	1.39
Weight Loss Ratio@300°C, %	2.15
Weight Loss Ratio@350°C, %	17.57
Thermal Conductivity W/mK	0.3
Thermal Resistance m²K/W	0.01
Volume Resistivity, ohm-cm	5*10¹⁵
Surface Resistivity, ohm	5*10¹⁴
Dielectric Constant 100HZ	4.1
Thermal Temperature Range, °C	-20~120

*¹ Specimen Cure Condition：70°C / 60min

*² CTE: Coefficient of Thermal Expansion

*³ Specimen Cure Condition：60°C / 60min

*⁴ Specimen Cure Condition：70°C / 30min

*⁵ Specimen Cure Condition：70°C / 60min

*⁶ Specimen Cure Condition：80°C / 20min

*⁷ Specimen Cure Condition：80°C / 60min

Appearance	Viscous liquid
Color	Black
Viscosity 25°C, S14 10rpm, cps	30,000-50,000
Viscosity 25°C, S14 1rpm, cps	90,000-200,000
Thixotropic Index	3-4

Pot Life 25°C, days	2
Cure Time 70°C, min	30
Cure Time 65°C, min	60

Everwide JC750 One Component Epoxy Adhesive

Features

Uncured Properties

Curing Properties

Cured Properties

Storage and Shelf Life

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