Everwide JC711-13 One Component Epoxy

Name: Everwide JC711-13 One Component Epoxy
Brand: Everwide

Color: Red

Viscosity

Hardness

Packaging

Product Type

Application

JC711-13 is one component epoxy that is designed for chipbonding. This resin has medium viscosity and high thixotropy. This product is used to cure at low temperature. This product is usable for screen printing and dispensing. This resin has good strong curing shapes without stringing and slumping at super high speed dispensing and very small dots. The hardening surface will not exhibit a surface oiliness. The cured product exhibits good adhesive strength, electrical insulation properties, excellent chemical resistance and solvent resistance. Stable adhesive strength can be obtained with a variety of SMT. This product is well suited for electronic devices encapsulation and chipbonding.

This product is solvent-free, non-volatile, system.

This product offers excellent retention of electrical insulation properties under high humidity conditions.

This resin has low stress, shrinkage and water absorption.

This resin exhibits medium viscosity and excellent thixotropy. This product can be also controlled flow and have sag resistance.

This resin is able to reduce the working time and increase the efficiency at the same time.

This product complies to the 2011/65/EU RoHS regulations.

This product complies to chlorine < 900ppm, bromine < 900ppm, chlorine + bromine < 1500ppm.

Glass Transition Temp.,(TMA), °C	125
CTE*³ (< Tg), μm/m/ °C	64
CTE*³ (> Tg), μm/m/ °C	215
Specific Heat 0°C, J/g°C	4.43
Specific Heat 25°C, J/g°C	4.56
Specific Heat 50°C, J/g°C	4.80
Specific Heat 75°C, J/g°C	5.04
Specific Heat 100°C, J/g°C	5.20
Durometer Hardness, Shore D	86
Specific Gravity	1.35
Water Absorption Ratio (25°C /24hr), %	0.23
Water Absorption Ratio (80°C /24hr), %	1.50
Water Absorption Ratio (97°C /1.5hr), %	0.60
Shear Strength*² Copper vs. Al, kg/cm²	316
Chip Thrust Test, 0603+FR4, 25°C ,kg	2.9
Chip Thrust Test, Diode+FR4, 25°C ,kg	2.4
Chip Thrust Test, IC +FR4, 25°C ,kg	7.8
Chip Thrust Test, MLCC +FR4, 25°C ,kg	3.7
Chip Hot Thrust Test, 0805, 25°C ,kg	3.4
Chip Hot Thrust Test, 0805, 80°C ,kg	3.8
Chip Hot Thrust Test, 0805, 120°C ,kg	3.3
Chip Hot Thrust Test, 0805, 180°C ,kg	1.7
Chip Hot Thrust Test, 0805, 240°C ,kg	1.1
Chip Hot Thrust Test, 0805, 280°C ,kg	0.9
Degradation Temp. (TGA 10°C /min), °C	337
Weight Loss Ratio@100°C, %	0.65
Weight Loss Ratio@150°C, %	0.79
Weight Loss Ratio@200°C, %	2.27
Weight Loss Ratio@250°C, %	2.71
Weight Loss Ratio@300°C, %	3.53
Weight Loss Ratio@350°C, %	5.92
Thermal Conductivity W/mK	0.3
Thermal Resistance, m²K/W	0.01
Surface Resistivity, ohm	4.5*10¹⁴
Volume Resistivity, Original, ohm-cm	4.5*10¹⁵
Volume Resistivity, ohm-cm, 100°CBoiling2hr	3.3*10¹⁵
Volume Resistivity, Original, ohm-cm	3.2*10¹⁴
Volume Resistivity, ohm-cm, 40°C95%RH100V*96hr	2.2*10¹⁴
Volume Resistivity, Original, ohm-cm	3.8*10¹⁴
Volume Resistivity, ohm-cm, 85°C85%RH50V*1,000hr	2.4*10¹⁴
Dielectric Constant, 100KHz	4.1
Dielectric Constant, 1MHz	3.9
Dielectric Constant, 10MHz	3.8
Dielectric Constant, 100MHz	3.7
Dielectric Strength, KV/mm	22

*¹ Specimen Cure Condition：120°C / 10 min

*² CTE：Coefficient of Thermal Expansion

*³ Specimen Cross-sectional Area：Thickness 3mm x Diameter 25mm

*⁴ When using this product, the surface resistivity and volume resistivity will not less than 10¹².

*⁵ The orders of magnitude of surface resistivity and volume resistivity will be raised if the thickness of specimen, curing time and reaction are increased.

Appearance	Liquid
Color	Red
Viscosity 25°C, S14 10rpm,cps	80,000-150,000
Thixotropic Index	>6

Pot Life 25°C, days	7
Through Cure Time 120°C by hot plate, sec	180
Through Cure Time 150°C by hot plate, sec	120
Through Cure Time 180°C by hot plate, sec	90

Everwide JC711-13 One Component Epoxy

Features

Uncured Properties

Curing Properties

Cured Properties

Storage and Shelf Life

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