Everwide JC812-2 Epoxy for SMT Devices Bonding

Name: Everwide JC812-2 Epoxy for SMT Devices Bonding
Brand: Everwide

Color: Red

Viscosity

Hardness

Packaging

Product Type

Application

JC812-2 is a one component epoxy that is designed for fast curing at low temperature. This resin has high viscosity and thixotropy. The reactivity of this product is good at the temperature higher than 90°C. This product can be used in the printing and the dispensing process without wire drawing and collapse. The hardening surface will not exhibit a surface oiliness. The cured product exhibits good adhesive strength, electrical insulation properties, excellent chemical resistance and solvent resistance. Stable adhesive strength can be obtained with a variety of SMT.

This product is solvent-free, non-volatile, system.

This resin exhibits high viscosity and excellent thixotropy. This product can be also controlled flow and have sag resistance.

This product offers excellent retention of electrical insulation properties under high humidity conditions.

This resin has high thixotropic properties which can keep the shape and it will not slump after curing.

This product complies to the 2011/65/EU RoHS regulations.

Glass Transition Temp. (MDSC), °C	28
CTE*² (0~20°C), μm/m/°C	63
CTE*² (100~120°C), μm/m/°C	174
Specific Heat 0°C, J/g°C	4.35
Specific Heat 25°C, J/g°C	4.71
Specific Heat 50°C, J/g°C	5.13
Specific Heat 75°C, J/g°C	5.34
Specific Heat 100°C, J/g°C	5.45
Durometer Hardness, Shore D	73
Specific Gravity	1.22
Water Absorption Ratio (25°C /24hr), %	0.38
Water Absorption Ratio (80°C /24hr), %	2.59
Water Absorption Ratio (97°C /1.5hr), %	1.82
Degradation Temp. (TGA 10°C /min), °C	311
Weight Loss Ratio@100°C, %	<0.5
Weight Loss Ratio@150°C, %	0.77
Weight Loss Ratio@200°C, %	1.40
Weight Loss Ratio@250°C, %	2.10
Weight Loss Ratio@300°C, %	3.68
Weight Loss Ratio@350°C, %	19.64
Thermal Conductivity W/mK	0.3
Thermal Resistance, m²K/W	0.01
Volume Resistivity, ohm-cm	4.5*10¹⁵
Surface Resistivity, ohm	4.5*10¹⁴
Dielectric Constant 1KHZ	3.2

*¹ Specimen Cure Condition：90°C / 30min

*² CTE: Coefficient of Thermal Expansion

Appearance	Liquid
Color	Red
Viscosity 25°C, S14 3rpm, cps	>220,000
Thixotropic Index	>6.5

Everwide JC812-2 Epoxy for SMT Devices Bonding

Features

Uncured Properties

Curing Properties

Cured Properties

Storage and Shelf Life

Related Product

Pot Life 25°C, days	2
Recommended Cure Time 90°C, min	3